BERGQUIST GAP PAD TGP 6000ULM

Description

Bergquist GAP PAD TGP 6000ULM is a game-changer for high-performance electronics requiring minimal assembly stress. This incredibly soft gap filler boasts a thermal conductivity of 6.0 W/m-K, effectively transferring heat even under low pressure. The secret lies in its unique formulation, featuring a special filler package and an ultra-low modulus resin. Furthermore, GAP PAD TGP 6000ULM conforms exceptionally well to uneven surfaces, ensuring optimal thermal performance regardless of topography. For user convenience, it comes with a natural tack on both sides, eliminating the need for additional adhesives and allowing for easy positioning during assembly. The top side has minimal tack for better handling and rework ability. Both sides are protected by removable liners.