Bergquist GAP PAD TGP 6000ULM

BERGQUIST® GAP PAD® TGP 6000ULM is a grey, silicone-based gap filler designed for high-performance thermal applications requiring a conductivity of 6.0 W/m-K. By utilising an ultra-low modulus resin formulation, the material optimizes thermal transfer at exceptionally low assembly pressures, ensuring peak performance without stressing delicate components.

The pad is constructed with a fiberglass reinforcement carrier that provides necessary structural integrity while maintaining its characteristic “ultra-soft” feel. This is paired with a unique filler package that allows for excellent “wet-out,” enabling the material to conform seamlessly to rough surfaces or complex topographies. Additionally, its high natural tack on both sides ensures it stays in place during assembly, which eliminates the need for extra adhesive layers that could otherwise impede thermal efficiency.

Ideal for applications such as telecommunications equipment, ASICs, DSPs, and consumer electronics, this material is a versatile choice for mounting thermal modules to heat sinks. With a UL 94 V-0 flammability rating and an operating temperature range of -60°C to 200°C, it provides a reliable, high-performance solution for sensitive electronics that require minimal compression stress.