Phase Change Materials (PCMs) are dry, thin pads that are placed in between a heatsink or component surface. Upon reaching the required melting temperature, the pad will fully change phase into a liquid to achieve maximum surface wetting for better thermal performance.
Products
Parker Chomerics Phase Change Materials
- Thermflow T 710
- Thermflow T 558
- Thermflow T 725
- Thermflow T 777
- Thermflow T 557
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Bergquist Phase Change Materials
- Hi-Flow THF 500
(Hi-Flow 625) - Hi-Flow THF 700 UT
(Hi-Flow 225 UT) - Hi-Flow THF 900
(Hi-Flow 105) - Hi-Flow THF 1500 P
(Hi-Flow 650 P) - Hi-Flow THF 1600 P
(Hi-Flow 300 P) - Hi-Flow THF 3000 UT
(Hi-Flow 565 UT) - Hi-Flow 1000 F AC
(Hi-Flow 225 F AC)
Applications
Phase Change Materials (PCMs) are dry, thin pads that are placed in between a heatsink or component surface. Upon reaching the required melting temperature, the pad will fully change phase into a liquid to achieve maximum surface wetting for better thermal performance.
Key Attributes
- Low thermal impedance
- Proven solution – years of production use in personal computer OEM applications
- Demonstrated reliability through thermal cycling and accelerated age testing
- Thermflow Non-Silicone, Phase-Change Thermal Interface Pads
- Can be pre-applied to heat sinks
- Protective release liner prevents contamination of material prior to final component assembly
- Tabs available for easy removal of release liner (T710, T725*, T557, T777, PC07DM) * T725 is only offered with a tab
- Available in custom die-cut shapes, kiss-cut on rolls
Applications
- Microprocessors
- Graphics processors
- Chipsets
- Memory modules
- Power modules
- Power semiconductors