Phase Change Materials

Phase Change Materials (PCMs) are dry, thin pads that are placed in between a heatsink or component surface. Upon reaching the required melting temperature, the pad will fully change phase into a liquid to achieve maximum surface wetting for better thermal performance.

Products

Parker Chomerics Phase Change Materials

  • Thermflow T 710
  • Thermflow T 558
  • Thermflow T 725
  • Thermflow T 777
  • Thermflow T 557

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Bergquist Phase Change Materials

Applications

Phase Change Materials (PCMs) are dry, thin pads that are placed in between a heatsink or component surface. Upon reaching the required melting temperature, the pad will fully change phase into a liquid to achieve maximum surface wetting for better thermal performance.

Key Attributes

  • Low thermal impedance 
  • Proven solution – years of production use in personal computer OEM applications 
  • Demonstrated reliability through thermal cycling and accelerated age testing 
  • Thermflow Non-Silicone, Phase-Change Thermal Interface Pads
  • Can be pre-applied to heat sinks 
  • Protective release liner prevents contamination of material prior to final component assembly 
  • Tabs available for easy removal of release liner (T710, T725*, T557, T777, PC07DM) * T725 is only offered with a tab
  • Available in custom die-cut shapes, kiss-cut on rolls

Applications

  • Microprocessors 
  • Graphics processors 
  • Chipsets 
  • Memory modules 
  • Power modules 
  • Power semiconductors