BERGQUIST GAP PAD TGP 1350

Description

GAP PAD TGP 1350 is a specially designed thermal gap pad ideal for delicate components. It features a highly conformable material that easily adapts to uneven surfaces for optimal heat transfer. A unique PEN film reinforcement enhances puncture resistance and allows for rework if needed. The tacky side provides excellent adhesion without compromising thermal performance. Available in various configurations, GAP PAD TGP 1350 offers a versatile solution for managing heat in sensitive electronics.