BERGQUIST GAP PAD TGP 2000

Description

GAP PAD TGP 2000 excels in low-stress applications demanding moderate to high thermal conductivity. Its exceptional conformability allows it to conform to uneven surfaces, effectively filling air gaps between PCBs, heat sinks, or metal chassis with complex shapes, rough finishes, and varying heights. For user convenience, GAP PAD TGP 2000 has natural tack on both sides for easy positioning during assembly. The material is protected by liners on both sides, with the topside having reduced tack for easier handling.