BERGQUIST GAP PAD TGP 2000

BERGQUIST GAP PAD TGP 2000 is a highly conformable, reinforced ” gap filler engineered for low-stress applications requiring a thermal conductivity of 2.0 W/m-K. Its exceptional softness allows the material to fill air voids and gaps between printed circuit boards and heat sinks, effectively adapting to stepped topographies, rough surface finishes, and high stack-up tolerances.
To ensure durability during handling and assembly, the pad is reinforced with glass fibres, providing excellent resistance to punctures and tears.
TGP 2000 features an inherent natural tack on both sides, offering “stick-in-place” characteristics that simplify positioning. For added user convenience, the top side is designed with reduced tack to facilitate easier handling, and both sides are protected by liners prior to use. This makes it an ideal solution for power electronics such as DC/DC converters, mass storage devices, and automotive engine or transmission controls. Operating reliably between -60°C and 200°C, it provides a stable thermal interface for complex metal chassis and high-performance ASICs.