Ablestik 2332-17

Available for RFQ

  • Bonds to a wide variety of substrates
  • One component
  • Solvent-free formulation
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Description

LOCTITE ABLESTIK 2332-17 offers a unique combination of low-temperature curing, high bond strength and flexibility. This makes it a versatile adhesive suitable for various bonding applications, particularly those involving heat-sensitive materials or requiring strong, durable bonds across a wide temperature range. This product is a solvent less epoxy adhesive that builds up a high bond strength when it has been cured at temperatures around 100 to 130℃.

Datasheets

Additional information

Weight N/A
Variant

180g Semco, 30cc Syringe

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