Thermally Conductive Adhesives & Encapsulants

Stycast 2850 FT Blue

Applications

Thermally conductive adhesives and encapsulants' purpose are to transfer heat while remaining electrically insulating. This reduces thermal strain in electronics and prevents performance loss or complete failure of electronic components. Most materials are silicone based with a boron nitride or alumina filler.

Applications include:

  • Heat sink bonding

  • Potting of components to fill air gaps

  • Automotive electronic control units (ECUs)

  • Engine control

  • Transmission control

  • Braking/traction control

  • Power conversion equipment

  • Power supplies and uninterruptible power supplies

  • Power semiconductors

  • MOSFET arrays with common heat sinks

  • Televisions and consumer electronics

  • Telecommunications equipment

  • LEDs/lighting

  • Desktop computers, laptops and servers

  • Handheld memory modules

  • Vibration dampening

Thermally conductive silicone adhesives and thermally conductive epoxy adhesives deliver on two fronts, the facilitation of thermal management objectives and the elimination of space-restrictive mechanical fasteners. They are available in liquid, tape and film derivatives.

Products

Frequently Asked Questions

Can you recommend an encapsulant that is approved for NASA outgassing?

We stock Stycast 2850FT with Catalyst 9, 23LV, 24LV and Stycast 2651W1 with Catalyst 9, which would both be appropriate.  We can also supply you with the outgassing data for these and several more.

What is a material's thermal conductivity measured in?

Their performance is measured in W/mK, which stands for Watts per meter-Kelvin.

Do you stock thermally conductive encapsulants?

Yes. We stock Ablestik 285, which has a thermal conductivity of around 1.3W/mK.