Thermally Conductive Adhesives & Encapsulants

Stycast 2850 FT Blue

Thermally conductive silicone adhesives and thermally conductive epoxy adhesives deliver on two fronts, the facilitation of thermal management objectives and the elimination of space-restrictive mechanical fasteners. They are available in liquid, tape and film derivatives.


Thermally Conductive Adhesives

Ablestik 281 (formerly Eccobond 281)

Ablestik 282 (formerly Eccobond 282)

Ablestik 285 & Cat 9 (formerly Eccobond 285 & Cat 9)

Ablestik 285 & Cat 17

Thermally Conductive Encapsulants

Stycast 1090 & Cat 9

Stycast 1090 & Cat 23 LV

Stycast 1090 & Cat 27-1

Stycast 1090 SI & Cat 9

Ablestik 285 & Cat 23 LV

Stycast 1495 K

Ablestik 285 & Cat 24 LV

Stycast 2762 & Cat 14


Thermally conductive adhesives and encapsulants' purpose are to transfer heat while remaining electrically insulating. This reduces thermal strain in electronics and prevents performance loss or complete failure of electronic components. Most materials are silicone based with a boron nitride or alumina filler.

Stycast 2762 & Cat 17 (BE)

​​​Stycast 2850 FT & Cat 9, Cat 11, Cat 23LV or Cat 24LV

Stycast 5952-1 AB

Stycast 4640

Frequently Asked Questions

Can you recommend an encapsulant that is approved for NASA outgassing?

We stock Stycast 2850FT with Catalyst 9, 23LV, 24LV and Stycast 2651W1 with Catalyst 9, which would both be appropriate.  We can also supply you with the outgassing data for these and several more.

Their performance is measured in W/mK.

Do you stock thermally conductive encapsulants?

Yes. We stock Ablestik 285, which has a thermal conductivity of around 1.3W/mK.

What is a material's thermal conductivity measured in?

Applications include:

  • Heat sink bonding

  • Potting of components to fill air gaps

  • Automotive electronic control units (ECUs)

  • Engine control

  • Transmission control

  • Braking/traction control

  • Power conversion equipment

  • Power supplies and uninterruptible power supplies

  • Power semiconductors

  • MOSFET arrays with common heat sinks

  • Televisions and consumer electronics

  • Telecommunications equipment

  • LEDs/lighting

  • Desktop computers, laptops and servers

  • Handheld memory modules

  • Vibration dampening