BERGQUIST GAP PAD TGP 40000SF

Description

BERGQUIST GAP PAD TGP 40000SF is the latest gap filling material from Henkel. With a thermal conductivity of 40 W/m-K, It is formulated for high performance applications requiring a silicone free, Carbon based filler solution. The material offers exceptional thermal performance at typical pressures due to its unique z-axis filler package. 40000SF has properties such as low bleed and outgassing.

This Gap Pad can come with a layer of PSA.

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