BERGQUIST GAP PAD TGP 40000SF

Bergquist Gap Pad TGP 40000SF is an ultra-high performance, silicone-free thermal interface material designed for demanding applications requiring both extreme heat dissipation and low outgassing. This black, non-silicone gap pad utilizes oriented filler technology to achieve a market-leading thermal conductivity of 40 W/m-K. Specifically engineered for sensitive environments where silicone contamination—such as oil bleed or volatile outgassing could compromise optical components, high-frequency circuits, or automotive sensors.

Its construction focuses on ease of handling and assembly, featuring a Shore 00 hardness of 85 and a density of 1.7 g/cc. While the material is not naturally tacky, it is available with an optional one-side pressure-sensitive adhesive (PSA) to facilitate fixturing during the manufacturing of high-density assemblies like 5G telecom hardware, GPUs, and AI accelerators.

Designed to operate reliably between –40°C and 150°C, TGP 40000SF provides exceptional thermal impedance that improves further under pressure. For example, at typical assembly pressures, the material achieves its optimal thermal performance at approximately 10% strain, effectively bridging the gap between heat-generating components and sinks. Its robust physical properties and compliance with high-reliability standards make it a premier choice for immersion cooling, aerospace defence electronics, and advanced vehicle control units.