BERGQUIST SIL PAD TSP 1600

Description

The SIL PAD TSP 1600 family of thermally conductive insulation materials is your ideal choice for applications demanding both high thermal performance and electrical isolation. These applications often involve low mounting pressure for securing components.

SIL PAD TSP 1600 excels in these situations due to its unique combination of a smooth, highly compliant surface and high thermal conductivity. This innovative design minimizes thermal resistance at low pressure, ensuring efficient heat transfer.

Typical applications include discrete semiconductors like TO-220, TO-247, and TO-218 packages, which are often mounted using spring clips. Spring clips offer a quick assembly method while applying minimal force to the delicate semiconductors. The smooth surface texture of SIL PAD TSP 1600 further enhances thermal performance by minimizing interfacial thermal resistance.