BERGQUIST GAP PAD TGP 12000ULM
Product Description
The BERGQUIST GAP PAD TGP 12000ULM takes thermal management to the next level. This gap filling material is designed specifically for high-performance applications where delicate components require minimal assembly stress. Despite its softness, it delivers outstanding heat transfer capabilities, keeping your electronics cool even under heavy workloads.
- Thermal Conductivity: 12 W/m-K.
High-compliance, low compression stress.
Ultra low modulus.
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Price range: £233.62 through £568.64 ex VAT
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