Cho-Bond 1038 & Primer 1086 (113g kit)

Available for RFQ

  • One component
  • Silver plated copper filler
  • Excellent conductivity – 0.010 ohm-cm
  • Medium paste
  • Easy to use – no weighing or mixing required
  • Moisture cure silicone
Due to you being outside the UK we cannot allow you to purchase Dangerous Goods, Please contact sales@hitek-ltd.co.uk if you require support.

Description

Cho-Bond 1038 & Primer 1086 (113g kit) is a silver-plated copper filled electrically conductive silicone, designed for EMI shielding or electrical grounding, it can be used as a fillet, gap filler and seam sealant. Supplied with Primer 1086.

Datasheets

Additional information

Weight 0.15 kg
Part Number

50-02-1038-0000 + Primer 1086

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