Description
Cho-Bond 1038 is a silver-plated copper filled electrically conductive silicone, designed for EMI shielding or electrical grounding, it can be used as a fillet, gap filler and seam sealant. Supplied with Primer 1086.
Available for RFQ
Cho-Bond 1038 is a silver-plated copper filled electrically conductive silicone, designed for EMI shielding or electrical grounding, it can be used as a fillet, gap filler and seam sealant. Supplied with Primer 1086.
Weight | 0.15 kg |
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Part Number | 50-02-1038-0000 + Primer 1086 |
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