BERGQUIST HI FLOW THF 500

BERGQUIST HI FLOW THF 500 is a film-reinforced phase-change material designed for power electronics requiring both electrical isolation and high-efficiency cooling.
The product features a specialised thermally conductive compound coated on a robust PEN film that activates at a phase-change temperature of 65°C. This transition point ensures that the material remains tack-free and scratch-resistant at room temperature, eliminating common shipping and handling difficulties and often removing the need for protective liners in production environments.

The reinforcement carrier provides exceptional mechanical strength, allowing the material to achieve a thermal impedance of 0.71°C-in²/W at 25 psi—comparable to the performance of traditional mica and grease assemblies but without the associated mess.
With a continuous-use temperature rating of 150°C, THF 500 is ideal for spring or clip-mounted power semiconductors and modules. Its film-based construction makes it easy to handle and install, providing a clean and reliable interface that guarantees both safety and thermal integrity.