Phase Change Materials

Phase Change Materials (PCMs) are dry, thin pads that are placed in between a heatsink or component surface. Upon reaching the required melting temperature, the pad will fully change phase into a liquid to achieve maximum surface wetting for better thermal performance. Applications include microprocessors, graphics processors, chipsets, memory modules, power modules and power semiconductors.

Key Attributes of phase change materials are:

• Low thermal impedance
• Proven solution – years of production use in personal computer OEM applications
• Demonstrated reliability through thermal cycling and accelerated age testing
• Thermflow Non-Silicone, Phase-Change Thermal Interface Pads
• Can be pre-applied to heat sinks
• Protective release liner prevents contamination of material prior to final component assembly
• Tabs available for easy removal of release liner (T710, T725*, T557, T777, PC07DM) * T725 is only offered with a tab
• Available in custom die-cut shapes, kiss-cut on roll