BERGQUIST HI FLOW THF 1600P

Description

HI FLOW THF 1600 P provides exceptional thermal performance with built-in electrical isolation for your electronic devices. This innovative material combines a 55°C phase change compound with a thermally conductive polyimide film. The polyimide reinforcement makes HI FLOW THF 1600 P easy to handle during assembly and helps prevent damage during shipping and storage due to its low phase change temperature.

This superior material boasts higher voltage breakdown and thermal performance compared to competing products. For user convenience, HI FLOW THF 1600 P comes on an easy-release liner, ideal for high-volume manual assembly applications.

Designed for applications requiring electrical isolation between electronic power devices and heat sinks, HI FLOW THF 1600 P works best with constant pressure. While specific data is not included here, Henkel recommends using spring clips to ensure optimal thermal performance. Please refer to the separate thermal performance data sheet to determine the appropriate spring pressure for your specific needs.