BERGQUIST GAP PAD TGP 5000

£78.87£230.59 ex VAT

  • High Thermal Conductivity: 5.0 W/m-K
  • Highly conformable, S-Class softness
  • Natural inherent tack reduces interfacial thermal resistance
  • Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Excellent thermal performance at low pressures
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SKU: TGP5000 Category: Tags: ,

Description

The BERGQUIST GAP PAD TGP 5000 is a unique gap filling material that combines impressive thermal performance with user-friendly features such as withstanding pulling and ripping for a durable and reliable application and it also efficiently transfers heat away from hot components, keeping your electronics cool.

Datasheets

Additional information

Weight N/A
Part Number

GP5000S35-0.020-02-0816 (0.508mm), GP5000S35-0.040-02-0816 (1.016mm), GP5000S35-0.060-02-0816 (1.524mm), GP5000S35-0.080-02-0816 (2.032mm), GP5000S35-0.100-02-0816, GP5000S35-0.125-02-0816

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