BERGQUIST GAP PAD TGP 5000

BERGQUIST GAP PAD TGP 5000 combines a high thermal conductivity of 5.0 W/m-K with “S-Class” softness and conformability. This unique material is designed to withstand the rigours of assembly, offering excellent resistance to pulling and ripping through its glass fibre reinforcement. Even under low mounting pressures, it maintains its structural integrity while conforming to demanding contours, ensuring that little to no stress is applied to fragile leads or sensitive PCB traces.

TGP 5000’s inherent tack on both sides reduces thermal resistance by effectively filling microscopic air gaps, while the top side is specially treated with reduced tack to facilitate smoother handling. This versatile interface is ideal for Voltage Regulator Modules (VRMs), ASICs, and thermally enhanced BGAs, as well as memory packages and PC-board-to-chassis connections. By providing a durable and highly conductive path for heat dissipation, TGP 5000 ensures that sophisticated electronics remain cool and reliable under heavy workloads.