BERGQUIST GAP PAD TGP 3500ULM

BERGQUIST GAP PAD TGP 3500ULM is an ultra-low modulus gap filler specifically engineered for delicate electronic components that require a “soft touch” during assembly.
With a thermal conductivity of 3.5 W/m-K, this TGP 3500ULM delivers peak performance under minimal pressure, significantly reducing the mechanical strain placed on fragile parts. It maintains an exceptionally conformable nature, allowing it to adapt seamlessly to irregular surfaces and ensure optimal contact between the heat source and the cooling solution.
TGP 3500ULM features a high natural tack on one side for “stick-in-place” convenience, while the top side is designed with minimal tack to allow for easier handling. Ideally suited for consumer electronics, ASICs, DSPs, and various PC applications, it provides a highly efficient and protective thermal management solution for high-density hardware.