Author: ISB

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Case Study – How HITEK Saved Easter

Disaster struck just days before the big day — the Easter Bunny suffered an unexpected accident and lost an ear during final prep!

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But panic didn’t last long. With our fast-acting team and trusty Permabond Engineering Adhesives 943 on hand, we had him back to his best in no time.

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💡 Why Permabond 943?

This low odour, non-fogging, non-frosting adhesive was the perfect solution for a clean, invisible bond – no smudges, no sticky residue, and no delays.

✔️ Low odour = happier helpers
✔️ No fogging = perfect photo finish
✔️ Strong, reliable hold = one hoppy Bunny

Another seasonal save thanks to smart materials and even smarter applications.

Permabond 943

Permabond 943

Weight: 20g

£14.74 ex VAT
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Video – TECHNOMELT Simply 3 Low Pressure Moulding

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Check out this video from Henkel about how and why you should use TECHNOMELT

Interested in this product?

TECHNOMELT is available through our online store, as a 20KG bag option. If that isn’t the right version for you, don’t fret, enquire below!

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Marketing Communications Preferences
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Technomelt PA 657 Black (20kg)

Technomelt PA 657 Black (20kg)

£906.41 ex VAT
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Case Study – Heat-Dissipating Gel Delivers Critical Cooling for 5G Infrastructure Systems

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Take a look below at a case study from Henkel about how they utilised BERGQUIST LIQUI-FORM TLF 6000HG as a 5g solution.

case-study-thermal-gel-critical-cooling-for-5g-infrastructure-systemsDownload

Interested in this product and the solution that is provided? Enquire here

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Marketing Communications Preferences
By ticking the above, you consent to HITEK Electronic Materials Ltd. collecting and processing your personal data for the purpose of sending you marketing communications. You can withdraw your consent at any time by clicking the unsubscribe link in the footer of any email you receive from us or by contacting us at hello@hitek-ltd.co.uk. For more information on how we use and protect your data, please read our Privacy Policy.
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Technical Tips – Henkel nomenclature

CORPORATE Product Acronyms

Struggling to understand the Acronyms used on or around Henkel products? Take a look at the table below for a list of different acronyms alongside an explanation as to what they mean.

AcronymExplanation
ABPAblestik ABP stands for “Advanced Bonding Paste.” This type of adhesive is designed for high-performance die-attach applications, offering excellent thermal and electrical conductivity.
(BE)Made in Belgium, dropped in favour of W1 during renaming in 2012-15.
CAAblestik CA = Conductive Adhesive.
CEAblestik CE = Conductive Epoxy.
CTECoefficient of Thermal Expansion – measures how much a material changes in size due to temperature changes.
ECFAblestik ECF = Electrically Conductive Film.
FTThe “FT” in Stycast 2850FT stands for “Filled thermally.”
GTThe “GT” in Stycast 2850GT stands for “Gritty Thermally conductive.” It contains hard and gritty fillers that enhance its thermal conductivity and mechanical properties.
ICPThe “ICP” in Ablestik ICP stands for “Isotropic Conductive Paste.” This type of adhesive provides electrical conductivity in all directions, making it suitable for applications such as surface-mount technology (SMT) assembly and die-attach processes.
KTThe “KT” in Stycast 2850KT stands for “Kool Thermally conductive.” This product is a two- component, room temperature curing epoxy encapsulant designed for high-voltage components and replacing heat sinks.
LMIAblestik 84-1 LMI stands for “Low Mobile Ion,” indicating that the adhesive is designed to minimize the presence of mobile ions, which can be crucial for maintaining the reliability and performance of electronic components.
MMThis indicates that the product is designed to be used with meter/mix dispensing equipment.
MTThe “MT” in Stycast 2850MT stands for “Medium Thermally conductive.
PCThe “PC” in Stycast PC stands for “Printed Circuit.” This indicates that the product is designed for use with printed circuit boards (PCBs), providing environmental and mechanical protection through conformal coatings.
QMIThe “QMI” in Ablestik QMI stands for “Quartz Micro-Insulated.” This indicates that the adhesive is designed with quartz fillers to provide excellent thermal and electrical conductivity.
SIStycast 1090 SI stands for “Syntactic Insulating.” This product is a lightweight syntactic encapsulant designed for applications where high compressive stress is applied to encapsulated circuitry, such as in deep ocean work.
W1The first formulation of this product to be made in Westerlo, Belgium. Mainly used in the European markets. This arises from REACH and RoHS regulations which meant Henkel had to reformulate some materials made elsewhere (USA/Asia) to prevent them from being excluded in Europe.
WLVThis stands for “Wafer Level Version,” indicating that the adhesive is optimized for wafer- level applications.

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Brand Spotlight – Shieldex

Todays #BrandSpotlight focuses on our partner for EMI Shielding fabrics and yarns, @Shieldex

With a broad range of products available, Shieldex offer products that aim to prevent EMI Interference. While we do offer yarns and fabrics online we also have the capability as their UK distributor to offer some of their shielded enclosure solutions.

Check out their brand page here to see exactly what they offer: https://www.hitek-ltd.co.uk/shop/shop-by-brand/shieldex/

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Product Spotlight – Shieldex Nora Dell Fabric

Today’s #ProductSpotlight is on @Shieldex Nora Dell.

A woven solution from Shieldex, this fabric offers a high level of thermal and electrical conductivity. Available as 500 x650mm or 1000x1300mm sizing this product provides shielding up to 56db in a 26-40 GHz frequency range. typically this product is used for most if not all technical situations that require high conductivity and shielding.

Shieldex Nora Dell Fabric

Shieldex Nora Dell Fabric

Price range: £56.93 through £134.52 ex VAT
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Features and benefits

  • Ni/Cu/Ag plated polyamide fabric.
  • Surface resistivity: average 0.009 ?/m2.
  • Shielding effectiveness : Average up to 95 dB from 300 MHz to 10 GHz.

#Shieldex #Fabric #protectingyourelectronics

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Product Spotlight – Bergquist Gap Pad TGP HC3000!

Today’s #ProductSpotlight focuses on @Henkel Bergquist Gap Pad TGP HC3000!

BERGQUIST GAP PAD TGP HC3000 is a gap filling material specifically designed for applications where components need a gentle touch. This soft and compliant material easily fills gaps and conforms to uneven surfaces, all while delivering impressive thermal performance (3.0 W/m-K).

BERGQUIST GAP PAD TGP HC3000

BERGQUIST GAP PAD TGP HC3000

Part Number: GPHC3.0-0.040-02-0816

£73.80 ex VAT
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Features and Benefits:

  • Thermal Conductivity: 3.0 W/m-K
  • High-compliance, low compression stress
  • Fiberglass reinforced for shear and tear resistance

#ChannelPartners #ThermalManagement #protectingyourelectronics

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Product Spotlight – Cho-Foil CCJ 18-201-0050

Today’s #ProductSpotlight focuses on @Parker Chomerics Cho-Foil CCJ 18-201-0050!

@Parker Chomerics’ CHO-FOIL® metal foil tapes provide an economical solution to applications requiring excellent electrical conductivity across substrates. These foil tapes can provide a low impedance connection between a braided cable shield and the metal connector back shell in moulded cables. Due to the highly conductive pressure sensitive acrylic adhesive (PSA), the tape can provide an effective shielded cable assembly without the need for soldering the tape to the braid 

Cho-Foil CCJ

Cho-Foil CCJ

Part Number: 18-201-0050

£33.60 – £41.35 ex VAT
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Features and Benefits:

  • Aluminium
  • Available in 16.45m or 32.91m rolls lengths
  • • Foil thickness 0.0508mm
  • Supplied with single sided conductive acrylic pressure sensitive adhesive
  • Temperature range from -40°C to +400°C
  • Electrical resistance of <0.0016 ohms/cm²
  • UL94 V-0 compliant

#Tapes #Thermalmanagement #protectingyourelectronics

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HITEK at the Henkel annual supplier awards 2024

HITEK receiving an award from Henkel to highlight great partnership

During the third week of November Henkel hosted its annual supplier awards. HITEK attended the ceremony in Greece with other electronics and metals distributors for Henkel.

At this years event HITEK won the “Expansion Leadership Through Continuous Growth award” which made us back to back winners having won the “Exceptional Performance Award” last year.

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HITEK’s 2023 Exceptional Performance Award

HITEK’s Managing Director took to LinkedIn to share the news of the award. Furthermore he congratulated his team stating he was ‘“‘Very proud of my team at HITEK Electronic Materials Ltd long may it continue.’

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Category Spotlight – Adhesives and Encapsulants

Today’s #CategorySpotlight focuses on Adhesives and Encapsulants. 

Adhesives come in a variety of different forms such as liquids, pastes and tapes for the purpose of bonding multiple substances together. Encapsulants are used to create a protective layer that is extremely moisture resistant. 

Take a look at our broad range of Adhesives and Encapsulants below: 
 
• Epoxy Encapsulants 
• Glob-Top Encapsulants 
• Polyurethane Encapsulants 
• Thermoplastics 
• Electrically Conductive Adhesives 
• Non-Conductive Adhesives 
• Non-Conductive Encapsulants 
• Structural Adhesives 
• Thermally Conductive Adhesives 
• Thermally Conductive Encapsulants 
 
Interested? Find our range here: https://www.hitek-ltd.co.uk/product-category/adhesives-and-encapsulants 
 
#Adhesives #Encapsulants #categoryspotlight #AdhesivesandEncapsulants