Stycast 1365-55

Stycast 1365-55 is a clear, two-component, epoxy encapsulant designed for the embedding and protection of stress-sensitive electronic components. Formulated as a shock-resistant, low-viscosity system, it provides a resilient protective barrier that allows for visual inspection and repair of encapsulated parts. Its excellent adhesion to various substrates and room-temperature cure capability make it a versatile choice for high-reliability assemblies where thermal and mechanical shock resistance are critical.

In its uncured state, Stycast 1365-55 requires a 1:1 mix ratio by weight of Part A and Part B. The resulting mixture features an exceptionally low viscosity of 270 mPa·s, allowing it to flow easily into intricate geometries and around tightly packed components without the strict necessity for vacuum de-airing. The system offers a manageable 4-hour pot life, providing ample time for the assembly of large or complex batches before the curing process begins. To prevent unwanted bonding to moulds, the use of a release agent like Mould Release 122 S is recommended.

The curing schedule is highly adaptable to production needs, ranging from 2 hours at 90°C for rapid throughput to 2 to 7 days at room temperature (25°C) for large castings where minimising exotherm is necessary. Once cured, the material reaches a Shore A hardness of 55, maintaining a balance between rigidity and flexibility. Electrically, it provides a high-volume resistivity of 1×10¹³ ohm-cm and a dielectric constant of 4.11, ensuring the long-term insulation and integrity of the embedded electronics against environmental contaminants and electrical failure.