Cho-Bond 1038 & Primer 1086 (113g kit)

Available for RFQ

  • One component
  • Silver plated copper filler
  • Excellent conductivity – 0.010 ohm-cm
  • Medium paste
  • Easy to use – no weighing or mixing required
  • Moisture cure silicone

Want to be notified when this product is back in stock?

Due to you being outside the UK we cannot allow you to purchase Dangerous Goods, Please contact sales@hitek-ltd.co.uk if you require support.

Description

Cho-Bond 1038 & Primer 1086 (113g kit) is a silver-plated copper filled electrically conductive silicone, designed for EMI shielding or electrical grounding, it can be used as a fillet, gap filler and seam sealant. Supplied with Primer 1086.

Datasheets

Additional information

Weight 0.15 kg
Part Number

50-02-1038-0000 + Primer 1086

Reviews

There are no reviews yet.

Be the first to review “Cho-Bond 1038 & Primer 1086 (113g kit)”

You may also like…