BERGQUIST SIL PAD TSP PPK1300

Description

BERGQUIST SIL PAD TSP PPK1300 combines the exceptional thermal properties of DuPont Kapton film with a boron nitride-filled polyester resin. This innovative composite material delivers superior thermal performance for your most critical applications. It boasts a low thermal resistance of 0.2 C/Watt, efficiently transferring heat away from electronic components. Additionally, SIL PAD TSP PPK 1300 offers excellent dielectric strength, making it ideal for applications requiring both thermal management and electrical isolation.