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BERGQUIST SIL PAD TSP Q2000

£27.48 ex VAT

  • Thermal impedance: 0.35ºC-in2/W @ 50 psi
  • Eliminates processing constraints typically associated with grease
  • Conforms to surface textures
  • Easy handling
  • May be installed prior to soldering and cleaning without worry
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SKU: BG0860 Category: Tags: ,

Description

BERGQUIST SIL PAD TSP Q2000 eliminates the risk of contamination associated with thermal grease, ensuring a cleaner and more reliable assembly process. You should apply the pad before soldering and cleaning, without any worry about causing issues during these processes.

Datasheets

No Datasheets available.

Additional information

Weight 0.232931 kg
Part Number

Q3-0.005-AC-1212

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