BERGQUIST SIL PAD TSP 1600

SKU: BERG0003

Product Description

BERGQUIST SIL PAD TSP 1600 family of thermally conductive insulation materials is your ideal choice for applications demanding both high thermal performance and electrical isolation. These applications often involve low mounting pressure for securing components.

BERGQUIST SIL PAD TSP 1600 excels in these situations due to its unique combination of a smooth, highly compliant surface and high thermal conductivity. This innovative design minimizes thermal resistance at low pressure, ensuring efficient heat transfer.

Typical applications include discrete semiconductors like TO-220, TO-247, and TO-218 packages, which are often mounted using spring clips. Spring clips offer a quick assembly method while applying minimal force to the delicate semiconductors. The smooth surface texture of SIL PAD TSP 1600 further enhances thermal performance by minimizing interfacial thermal resistance.

  • Thermal impedance: 0.45C-in2/W @ 50 psi
  • High value material
  • Smooth and highly compliant surface
  • Electrically isolating
  • Part Name – SP800S-0.005-AC-1212

Additional Info

Weight

0.241 kg

Weight 0.241 kg
Part Number

SP800S-0.005-AC-1212

Reviews

Reviews

There are no reviews yet.

Be the first to review “BERGQUIST SIL PAD TSP 1600”

£34.80 ex VAT

In stock (can be backordered)

x
Add to RFQ Basket