Ablestik 59c

Ablestik 59C is a silver-filled, silicone-based, adhesive engineered for high-temperature electronic applications that require exceptional electrical and thermal conductivity.

With an impressive operating range from -55°C to 260°C, this die-attach material is specifically designed for scenarios where electrical continuity and thermal dissipation are paramount, and a high mechanical bond strength is not required. As a pressure-sensitive adhesive with high flexibility and tack, it remains reworkable even after processing, providing significant advantages for complex or high-value assemblies.

Ablestik 59C features a thixotropic consistency, which ensures easy application while preventing sealant movement after placement. It is a one-component adhesive containing solvent, although it can be combined with various catalysts to tailor its curing profile. Loctite Ablestik 59C is unique in its versatility, as it can be utilised in either its cured or uncured state depending on the requirements. Its high thermal conductivity (7 W/m-K) and extremely low volume resistivity make it an industry standard for heat-sensitive conductive bonding.