BERGQUIST GAP PAD TGP 5000
Product Description
The BERGQUIST GAP PAD TGP 5000 is a unique gap filling material that combines impressive thermal performance with user-friendly features such as withstanding pulling and ripping for a durable and reliable application and it also efficiently transfers heat away from hot components, keeping your electronics cool.
- High Thermal Conductivity: 5.0 W/m-K
- Highly conformable, S-Class softness
- Natural inherent tack reduces interfacial thermal resistance
- Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads
- Fiberglass reinforced for puncture, shear and tear resistance
- Excellent thermal performance at low pressures
Additional Info
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Price range: £78.87 through £230.59 ex VAT
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