BERGQUIST GAP PAD TGP 3000
Product Description
BERGQUIST GAP PAD TGP 3000 delivers efficient heat transfer even with minimal clamping force. A combination of fillers and a low-modulus resin allows for both soft handling and exceptional thermal performance.
- Thermal Conductivity: 3.0 W/m-K.
- Low S-Class thermal resistance at very low pressures.
- Highly conformable, S-Class softness.
- Designed for low-stress applications.
- Fiberglass reinforced for puncture, shear and tear resistance.
Additional Info
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