BERGQUIST GAP PAD TGP 3000

BERGQUIST GAP PAD TGP 3000 is a high-performance thermal gap filler that provides exceptional thermal conductivity of 3.0 W/m-K at very low assembly pressures. By combining a specialised filler package with a low-modulus resin, this material achieves superior heat transfer while remaining soft and elastic. Its highly conformable nature ensures excellent “wet-out” on surfaces with high roughness or complex topographies, making it an ideal choice for low-stress applications that typically use fixed stand-offs or clip mounting.

To enhance durability and ease of use, the pad is reinforced with glass fibre, providing robust resistance to punctures and tears.
The material features a natural inherent tack on both sides to facilitate positioning during assembly, eliminating the need for extra adhesive layers that could impede cooling. TGP 3000 is particularly suited for use within processors, server S-RAMs, mass storage drives, and wireless communication hardware.