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HITEK at the Henkel annual supplier awards 2024

HITEK receiving an award from Henkel to highlight great partnership

During the third week of November Henkel hosted its annual supplier awards. HITEK attended the ceremony in Greece with other electronics and metals distributors for Henkel.

At this years event HITEK won the “Expansion Leadership Through Continuous Growth award” which made us back to back winners having won the “Exceptional Performance Award” last year.

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HITEK’s 2023 Exceptional Performance Award

HITEK’s Managing Director took to LinkedIn to share the news of the award. Furthermore he congratulated his team stating he was ‘Very proud of my team at HITEK Electronic Materials Ltd long may it continue.’

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Category Spotlight – Adhesives and Encapsulants

Today’s #CategorySpotlight focuses on Adhesives and Encapsulants. 

Adhesives come in a variety of different forms such as liquids, pastes and tapes for the purpose of bonding multiple substances together. Encapsulants are used to create a protective layer that is extremely moisture resistant. 

Take a look at our broad range of Adhesives and Encapsulants below: 
 
• Epoxy Encapsulants 
• Glob-Top Encapsulants 
• Polyurethane Encapsulants 
• Thermoplastics 
• Electrically Conductive Adhesives 
• Non-Conductive Adhesives 
• Non-Conductive Encapsulants 
• Structural Adhesives 
• Thermally Conductive Adhesives 
• Thermally Conductive Encapsulants 
 
Interested? Find our range here: https://www.hitek-ltd.co.uk/product-category/adhesives-and-encapsulants 
 
#Adhesives #Encapsulants #categoryspotlight #AdhesivesandEncapsulants 

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HITEK History – HITEK’s Website Turns One

Today marks 1 year of this HITEK website. 

This time last year we bid farewell to our old website by it “glitching “transforming” into our new website. A year on since that faithful day a lot has changed.  

From hundreds of new products arriving onsite, to our new RFQ system we’ve been constantly building and improving our site. While this is only a small milestone, there is a lot more to come over the coming months and we hope that our efforts are worthwhile as our site continues to grow in age! 

Take a look at how we announced our site below. 

#HITEKHistory #Website #protectingyourelectronics

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Brand Spotlight – Bergquist 

Today’s #BrandSpotlight is on @Bergquist. 

Bergquist (From Henkel) are one of our key Thermal Management brands.   Providing products spanning from Gap Pads & Sil Pads to Hi-Flow and Bond-Ply. Their products come in a multitude of thicknesses and dimensions allowing for them to excel as thermal solutions. 

To check out Bergquists product range visit here: https://www.hitek-ltd.co.uk/product-category/thermal-management/thermal-insulating-pads 

#protectingyourelectronics #Berquist #ChannelPartner 

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Technical Tips – Applying Cho-Bond 1038 & 1075

Today we bring you a Technical Tips on applying Cho-Bond 1038 & 1075.

The application of Cho-Bond typically starts with a primer . Then solvent-based primer dries up quickly meaning that it is effective when used on metalwork/grooves. Cho-Bond can then be applied as a thin layer to create a gasket.

To find out the full works on how to properly apply Cho-Bond 1038 & 1075 read the full piece here.

#protectingyourelectronics #Chomerics #Application #protectingyourelectronics

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Product Spotlight – LOCTITE STYCAST 2651-40 W1

Today’s #ProductSpotlight focuses on @Henkel LOCTITE STYCAST 2651-40 W1

STYCAST 2651-40 W1 is a epoxy encapsulant designed for general potting and encapsulation applications. This product also has the ability to be cured at room temperature or an elevated temperature environment.

Features and Benefits

Low viscosity
Room temperature cure capability
Can be used with a variety of catalysts

#ChannelPartners #Adhesives #protectingyourelectronics

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Technical Tips – Degassing Adhesive Products

tech tips degassing adhesive 01 scaled

Although most, if not all, suppliers of formulated Epoxy and Polyurethane materials manufacture products
under vacuum. This still can cause some undesirable trapped gases that appear while using these compounds.

The most common causes of bubbling

  • Air inclusion during the mixing of the resin and hardener together.
  • Air trapped in moulds.
  • Air trapped due to improper casting/moulding techniques.
  • Air introduced by suction as the material shrinks or due to a leaking tool.
  • Trapped residual solvent vapours from certain types of mould releases.
  • Volatile components being stripped out of the materials while casting under vacuum.
  • Gases generated during the reaction (hardening) process.
  • Gases formed during improper storage (moisture contamination etc.)
  • Gases introduced through pressurized systems.
  • Air from improperly de-aired resin and/or hardener.

How to solve/prevent the issue?

The first and most important step in eliminating the problems caused by bubbles is simply taking care not to introduce air while handling the materials. If it is unavoidable to introduce air during mixing, such as during mixing by hand, it is highly desirable to remove the trapped gases under vacuum before using the mix. Gaseous bubbles trapped in a liquid, although initially microscopic in size, will expand when heated and can grow to become large enough to cause problems.
Polyurethane products are moisture sensitive. In fact they crave moisture and should not be mixed during days when the humidity is high. Urethane resins and hardeners should be protected from picking up moisture by applying a layer on Nitrogen on top of the material in the containers. Mixing urethane resin and hardener components together is best achieved under vacuum or at least under a blanket of Nitrogen. Moisture contaminated polyurethane products will exhibit many tiny bubbles on the surface or, in extreme cases, will rise to produce foam. These bubbles are next to impossible to remove.

As a rule, epoxy compounds are less moisture sensitive, except for certain hardeners. Moisture contaminated epoxy hardeners can be usually recognized by the formation of a crust around the edges of the container.

Moisture contaminated epoxy hardeners, depending on the formulation, will react faster than expected with the resin.
Bubbles tend to rise to the surface of the material and will, under ideal circumstances, given enough time,
will eventually release from the liquid. Most applications do not allow for the required time or the proper
conditions for products to self de-air, vacuum must be applied to speed the removal of trapped gases from
the mix

What can affect the process of removing gasses?

  • The viscosity of the mix: The higher the viscosity the more difficult it is to remove gases.
  • The surface tension of the materials: Can be reduced by heating and the addition of surfactants
  • The temperature of the epoxy or urethane mix: Heating the material will reduce the viscosity. Be sure to consider the pot life and gel time before heating any mixed materials.
  • The amount of epoxy or urethane material being de-aired at one time:
    • The depth to surface ratio is important.
    • The larger the surface that is exposed to the vacuum the better.
  • The lower the amount of product the rising bubbles must travel through the better. Agitation: Agitation (mixing) during the de-airing process (while under vacuum) will speed the removal of air considerably.

Alternative methods to remove or minimise the impact of trapped gasses

  • Thin film de-airing: The material is exposed to vacuum in a thin film. This is probably the best and fastest method of removing trapped gases.
  • Centrifugal force: Trapped gases may be forced out of the product by centrifugal forces by spinning at high speeds. This is not a widely practiced method and has limited possibilities in common applications.
  • Pressure: The application of pressure during the gelation process will reduce the size of the bubbles. The amount of pressure necessary will have to be determined by experimentation. Depending on the component configuration it is not uncommon to use 80 to 100 psi.
  • Vibration: Placing the mixture on a vibrating table will assist the bubbles in travelling to the surface.

How to produce bubble free epoxy or urethane castings

  • The least number and amount of volatile ingredients.
  • The lowest possible viscosities (individual components and mixed)

Hand Mixing

  • De-air each component containing fillers individually.
  • Do not use violent motion during mixing and scrape the sides of the container to insure a thorough mix. De-gas the mixture under vacuum if possible.
  • If vacuum is not available, allow the mix to stand for a period of time to allow the coarse
  • bubbles to escape prior to pouring (don’t forget to consider the pot life)

Mix/Dispense Equipment

  • Take precautions to minimize air entrapment while topping up the storage tanks. Slow, steady pouring into one spot will minimize air inclusion. De-air the materials in the storage tanks if possible.
  • Keep the fittings, valves and dispense pistons in good repair. Defective components will allow air to be sucked into the dispense lines.
  • Cavitations and lead/lag problems can be sources for air inclusions.

Pouring

  • Pour slowly into one corner of the mould or container. Pouring slowly will allow the rising material to push the air ahead of it minimizing air entrapment.
  • Pour with the least amount of turbulence.

Curing

  • If possible, de-air the poured assembly prior to cure. This step is not necessary for parts involving small volumes. Large mass castings or castings with complicated shapes, conducive to air entrapment, should be de-aired prior to cure for best results.
  • Establish and use the appropriate temperatures that result in slow, even gelation. Provide a enough reservoir of cool material to replenish the shrinkage that takes place during gelation and cure.

Other Suggestions

  • Hydraulic hose fittings on vacuum lines allow for leak free connections and better vacuum.
  • 29” Hg of vacuum is sufficient for most applications.
  • 2 mm of vacuum has been found sufficient for high volume production.
  • Always use a large enough container to allow the material to rise under vacuum.
  • It may be helpful to add a drop or two of a suitable surfactant.

Precautions

Almost all formulated epoxy and urethane materials contain at least some volatile ingredients. These ingredients are an essential part of the product and will start flashing off under vacuum. This is evidenced by the fact that the mix being de-aired never seems to be totally free of bubbles no matter how long it is vacuumed. Care should be taken not to vacuum strip the material. In most cases vacuum at 29” Hg for 5- 10 minutes will sufficiently de-gas the mixture.

Download a copy of the technical tips below

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Product Spotlight – Cho-Therm 62-15-0808-1671 (with PSA)

Today’s #ProductSpotlight focuses on @ParkerChomerics Cho-Therm 62-15-0808-1671 (with PSA)!

Cho-Therm insulator pads are designed for use where thermal, dielectric and mechanical properties are needed at their highest level. With a solid history spanning multiple decades in varying situations, Cho-Therm is the go-to product for industrial, Aerospace and Military applications 

Features and Benefits:

  • 203mm x 203mm sheet with adhesive backing
  • Excellent thermal properties
  • High dielectric strength
  • Fibreglass cloth reinforced 
  • Excellent mechanical strength and puncture resistance

#Thermal #InsulatorPads #Cho-therm #protectingyourelectronics

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Best Seller – October

Now that October is over its time to announce the #BestSeller. This months pot goes to @Permabond ET536!

Permabond ET536 (50Ml) is a two-part, 1:1 mixable epoxy adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plastics and composites. Permabond ET536 forms tough bonds providing high peel resistance and high shear strength. The extended work life of this product allows for adjustment and makes it more suitable for larger applications. Permabond ET536 has good impact strength and chemical resistance, a high shear and peel strength, and is easy to apply.

Please note that 50ml cartridges require a manual dispensing gun (sold separately).

Features and Benefits:

  • Adhesion to a wide variety of substrates
  • Full cure at room temperature
  • Easy to apply
  • High shear and peel strength
  • Good impact strength
  • Good chemical resistance
  • Non-drip rheology

#Permabond #protectingyourelectronics #Adhesive

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Technical Tips – Surface vs Volume Resistivity

Today we bring you a Technical Tips on how to measure resistance of materials.

There are two main methods used to calculate resistance of elastomeric materials, a pressure probe or a surface probe (in this case a CHO-PROBE). With the use of these probes different methods can be used to calculate the Volume resistivity,

Check out the full tech tips from Parker Chomerics below to get a better grasp on the topic!

#Resistivity #TechTip #protectingyourelectronics #SurfacevsVolumeResistivity