Thermal Grease 65-00-T670-0080 (80cc)

£170.35 ex VAT

  • Silicone based materials conduct heat between a hot component and a heat sink or enclosure
  • Fills interface variable tolerances in electronics assemblies and heat sink applications
  • Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration
  • Thermally stable and require virtually no compressive force to deform under typical assembly pressures
  • Supports high power applications requiring material with minimum bond line thickness and high conductivity
  • Ideal for rework and field repair situations
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Description

Parker Chomerics T670 Thermal Grease has a high performance thermal conducitivity of 3.0 W/m-k and is an ideal grease for thin bond line applications. T670 is a white material which offers low thermal impedance as it will typically achieve a very thin bond line (0.001 in). Typical greases within Chomerics thermal grease assortment offer a range of performance covering the simplest to the most demanding thermal requirements.

This high performance grease is supplied within an easily accessible metal can or pill. Mix this product with a spatula and remove the desired amount onto either the component or stencil screen. Now stencil the desired part size onto a heat sink for immediate assembly or shipping.

Datasheets

Additional information

Weight 0.454 kg

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