Permabond ES558 (320ml)

Permabond ES558 is a single-part epoxy paste specifically formulated to flow like solder when heated during the curing process. Featuring a silver-grey finish, it is an ideal solution for bonding a wide range of materials, including metals, ferrites, ceramics, and composites, particularly in applications where the adhesive needs to penetrate tight joints or cover intricate surfaces.

With exceptionally high impact resistance and excellent peel and shear strength, Permabond ES558 provides a durable, toughened bond that withstands thermal cycling and mechanical stress. This adhesive is designed for ease of use, as it requires no manual mixing or weighing, and maintains its integrity through demanding industrial processes such as paint baking and wave soldering.

ES558 is ideal for high-performance engineering and automated assembly as it offers a maximum gap fill of 0.5mm and exhibits free flow at high temperatures. It can reach full cure in as little as 40 minutes at 170°C, or under 3 minutes when using induction curing methods.