BERGQUIST SIL PAD TSP Q2000
Product Description
BERGQUIST SIL PAD TSP Q2000 eliminates the risk of contamination associated with thermal grease, ensuring a cleaner and more reliable assembly process. You should apply the pad before soldering and cleaning, without any worry about causing issues during these processes.
- Thermal impedance: 0.35C-in2/W @ 50 psi
- Eliminates processing constraints typically associated with grease
- Conforms to surface textures
- Easy handling
- May be installed prior to soldering and cleaning without worry
Additional Info
| Weight | 0.232 kg |
|---|
| Weight | 0.232 kg |
|---|---|
| Part Number | Q3-0.005-AC-1212 |
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