BERGQUIST SIL PAD TSP Q2000
Product Description
BERGQUIST SIL PAD TSP Q2000 eliminates the risk of contamination associated with thermal grease, ensuring a cleaner and more reliable assembly process. You should apply the pad before soldering and cleaning, without any worry about causing issues during these processes.
- Thermal impedance: 0.35ºC-in²/W @ 50 psi.
- Eliminates processing constraints typically associated with grease.
- Conforms to surface textures.
- Easy handling.
- May be installed prior to soldering and cleaning without worry.
Additional Info
| Weight | 0.232 kg |
|---|
| Weight | 0.232 kg |
|---|---|
| Part Number | Q3-0.005-AC-1212 |
Reviews
You must be logged in to post a review.
Available for Quote
Related products
-
Ablestik 45LV
Available for RFQDue to you being outside the UK we cannot allow you to purchase Dangerous Goods, Please contact sales@hitek-ltd.co.uk if you require support. -
Stycast 2651MM
Available for RFQDue to you being outside the UK we cannot allow you to purchase Dangerous Goods, Please contact sales@hitek-ltd.co.uk if you require support. -
Ablestik 59c
Available for RFQDue to you being outside the UK we cannot allow you to purchase Dangerous Goods, Please contact sales@hitek-ltd.co.uk if you require support.
Reviews
There are no reviews yet.