BERGQUIST HI FLOW THF 500
Product Description
The BERGQUIST HI FLOW THF 500 is a film-based material which combines a thermally conductive paste that activates at 65C with a strong PEN plastic backing. It’s ideal for placing between hot electronic components and heat sinks, efficiently transferring heat without compromising electrical safety.
- Thermal impedance: 0.71℃-in²/W @ 25 psi.
- Electrically isolating.
- 65℃ phase change compound coated on PEN film.
- Tack-free and scratch-resistant.
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