BERGQUIST GAP PAD TGP HC5000

BERGQUIST GAP PAD TGP HC5000 is a high-performance, silicone-based interface material specifically engineered for applications requiring a balance of high thermal conductivity and low assembly stress. With a rating of 5.0 W/m-K, this soft and compliant gap filler utilizes a unique filler package and low-modulus resin formulation to deliver exceptional thermal transfer, even at low pressures. Its conformable nature ensures superior “wet-out” characteristics, allowing it to adapt seamlessly to surfaces with high roughness or irregular topographies.

The material is reinforced with a glass fibre carrier, which provides essential resistance to shear and tear forces while maintaining the pad’s characteristic flexibility. For streamlined assembly, TGP HC5000 features a natural inherent tack on both sides, eliminating the need for thermally impeding adhesive layers. The top side is specifically designed with minimal tack to facilitate easier handling during the manufacturing process, and the product is supplied with protective liners on both sides to maintain integrity.

Ideally suited for telecommunications hardware, consumer electronics, and the mounting of thermal modules to heat sinks, TGP HC5000 is a reliable choice for protecting sensitive ASICs and DSPs. It operates effectively across a temperature range of -60°C to 200°C and is rated UL 94 V-0 for flammability. Available in standard sheet forms and custom die-cut parts, with thicknesses ranging from 0.508mm to 3.175mm, it provides a versatile solution for filling air gaps while minimising mechanical strain on boards and components.