BERGQUIST GAP PAD TGP A2600
Product Description
Bergquist Gap Pad TGP A2600 is a silicone based golden gap filling material. Designed for thermally conductive applications offering 2.6 W/m-coefficient.
Built with a fiberglass reinforcement layer which provides resistance to wear and tear as well as providing assisting with the burn-in and rework processes on the darker half of the pad. As for the Lighter gold side, the material is much softer which allows for more compliance to applications.
Typical applications include usage between CPU’s and heat sinks/dispersers, heat pipe assemblies as well as telecommunications devices.
- Thermal Conductivity: 2.6 W/m-K.
- Fiberglass reinforced for puncture, shear and tear resistance.
- Reduced tack on one side to aid in application assembly.
- Electrically isolating.
Additional Info
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