BERGQUIST GAP PAD TGP 40000SF
Product Description
BERGQUIST GAP PAD TGP 40000SF is the latest gap filling material from Henkel. With a thermal conductivity of 40 W/m-K, It is formulated for high performance applications requiring a silicone free, Carbon based filler solution. The material offers exceptional thermal performance at typical pressures due to its unique z-axis filler package. 40000SF has properties such as low bleed and outgassing.
This Gap Pad can come with a layer of PSA.
- Thermal Conductivity: 40 W/m-K
- No silicone outgassing
- No silicone extraction
- No mobile polymer bleed
- Not electrically insulating
Additional Info
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