BERGQUIST GAP PAD TGP 12000ULM

£233.62£568.64 ex VAT

  • Thermal Conductivity: 12 W/m-K
  • High-compliance, low compression stress
  • Ultra low modulus
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SKU: TGP12000ULM Category: Tag:

Description

The BERGQUIST GAP PAD TGP 12000ULM takes thermal management to the next level. This gap filling material is designed specifically for high-performance applications where delicate components require minimal assembly stress. Despite its softness, it delivers outstanding heat transfer capabilities, keeping your electronics cool even under heavy workloads.

Datasheets

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Additional information

Weight N/A
Part Number

TGP12000ULM-0.040-00-0808, TGP12000ULM-0.080-00-0808, TGP12000ULM-0.100-00-0808, TGP12000ULM-0.125-00-0808

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