BERGQUIST GAP PAD TGP 12000ULM

BERGQUIST GAP PAD TGP 12000ULM represents a significant advancement in thermal management, specifically engineered for high-performance environments where delicate components require minimal assembly stress. Rated at an exceptional thermal conductivity of 12.0 W/m-K, this extremely soft gap filler maintains outstanding heat dissipation even under heavy workloads. Its ultra-low modulus resin formulation and unique filler package allow it to achieve peak performance at remarkably low pressures, protecting sensitive circuitry from mechanical strain.

The material is highly conformable, ensuring excellent “wet-out” as it adapts to rough or irregular surface topographies. For ease of integration, it is supplied with protective a liners on both sides and is available in either grey or red to suit specific aesthetic or coding requirements. With a continuous operating range of -60°C to 200°C and a UL 94 V-0 flammability rating, it is an ideal choice for demanding infrastructure such as telecommunications routers, base stations, optical transceivers, and high-speed ASICs.