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HITEK History – HITEK’s Website Turns One

Today marks 1 year of this HITEK website. 

This time last year we bid farewell to our old website by it “glitching “transforming” into our new website. A year on since that faithful day a lot has changed.  

From hundreds of new products arriving onsite, to our new RFQ system we’ve been constantly building and improving our site. While this is only a small milestone, there is a lot more to come over the coming months and we hope that our efforts are worthwhile as our site continues to grow in age! 

Take a look at how we announced our site below. 

#HITEKHistory #Website #protectingyourelectronics

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Technical Tips – Applying Cho-Bond 1038 & 1075

Today we bring you a Technical Tips on applying Cho-Bond 1038 & 1075.

The application of Cho-Bond typically starts with a primer . Then solvent-based primer dries up quickly meaning that it is effective when used on metalwork/grooves. Cho-Bond can then be applied as a thin layer to create a gasket.

To find out the full works on how to properly apply Cho-Bond 1038 & 1075 read the full piece here.

#protectingyourelectronics #Chomerics #Application #protectingyourelectronics

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Technical Tips – Degassing Adhesive Products

tech tips - degassing adhesive-01

Although most, if not all, suppliers of formulated Epoxy and Polyurethane materials manufacture products
under vacuum. This still can cause some undesirable trapped gases that appear while using these compounds.

The most common causes of bubbling

  • Air inclusion during the mixing of the resin and hardener together.
  • Air trapped in moulds.
  • Air trapped due to improper casting/moulding techniques.
  • Air introduced by suction as the material shrinks or due to a leaking tool.
  • Trapped residual solvent vapours from certain types of mould releases.
  • Volatile components being stripped out of the materials while casting under vacuum.
  • Gases generated during the reaction (hardening) process.
  • Gases formed during improper storage (moisture contamination etc.)
  • Gases introduced through pressurized systems.
  • Air from improperly de-aired resin and/or hardener.

How to solve/prevent the issue?

The first and most important step in eliminating the problems caused by bubbles is simply taking care not to introduce air while handling the materials. If it is unavoidable to introduce air during mixing, such as during mixing by hand, it is highly desirable to remove the trapped gases under vacuum before using the mix. Gaseous bubbles trapped in a liquid, although initially microscopic in size, will expand when heated and can grow to become large enough to cause problems.
Polyurethane products are moisture sensitive. In fact they crave moisture and should not be mixed during days when the humidity is high. Urethane resins and hardeners should be protected from picking up moisture by applying a layer on Nitrogen on top of the material in the containers. Mixing urethane resin and hardener components together is best achieved under vacuum or at least under a blanket of Nitrogen. Moisture contaminated polyurethane products will exhibit many tiny bubbles on the surface or, in extreme cases, will rise to produce foam. These bubbles are next to impossible to remove.

As a rule, epoxy compounds are less moisture sensitive, except for certain hardeners. Moisture contaminated epoxy hardeners can be usually recognized by the formation of a crust around the edges of the container.

Moisture contaminated epoxy hardeners, depending on the formulation, will react faster than expected with the resin.
Bubbles tend to rise to the surface of the material and will, under ideal circumstances, given enough time,
will eventually release from the liquid. Most applications do not allow for the required time or the proper
conditions for products to self de-air, vacuum must be applied to speed the removal of trapped gases from
the mix

What can affect the process of removing gasses?

  • The viscosity of the mix: The higher the viscosity the more difficult it is to remove gases.
  • The surface tension of the materials: Can be reduced by heating and the addition of surfactants
  • The temperature of the epoxy or urethane mix: Heating the material will reduce the viscosity. Be sure to consider the pot life and gel time before heating any mixed materials.
  • The amount of epoxy or urethane material being de-aired at one time:
    • The depth to surface ratio is important.
    • The larger the surface that is exposed to the vacuum the better.
  • The lower the amount of product the rising bubbles must travel through the better. Agitation: Agitation (mixing) during the de-airing process (while under vacuum) will speed the removal of air considerably.

Alternative methods to remove or minimise the impact of trapped gasses

  • Thin film de-airing: The material is exposed to vacuum in a thin film. This is probably the best and fastest method of removing trapped gases.
  • Centrifugal force: Trapped gases may be forced out of the product by centrifugal forces by spinning at high speeds. This is not a widely practiced method and has limited possibilities in common applications.
  • Pressure: The application of pressure during the gelation process will reduce the size of the bubbles. The amount of pressure necessary will have to be determined by experimentation. Depending on the component configuration it is not uncommon to use 80 to 100 psi.
  • Vibration: Placing the mixture on a vibrating table will assist the bubbles in travelling to the surface.

How to produce bubble free epoxy or urethane castings

  • The least number and amount of volatile ingredients.
  • The lowest possible viscosities (individual components and mixed)

Hand Mixing

  • De-air each component containing fillers individually.
  • Do not use violent motion during mixing and scrape the sides of the container to insure a thorough mix. De-gas the mixture under vacuum if possible.
  • If vacuum is not available, allow the mix to stand for a period of time to allow the coarse
  • bubbles to escape prior to pouring (don’t forget to consider the pot life)

Mix/Dispense Equipment

  • Take precautions to minimize air entrapment while topping up the storage tanks. Slow, steady pouring into one spot will minimize air inclusion. De-air the materials in the storage tanks if possible.
  • Keep the fittings, valves and dispense pistons in good repair. Defective components will allow air to be sucked into the dispense lines.
  • Cavitations and lead/lag problems can be sources for air inclusions.

Pouring

  • Pour slowly into one corner of the mould or container. Pouring slowly will allow the rising material to push the air ahead of it minimizing air entrapment.
  • Pour with the least amount of turbulence.

Curing

  • If possible, de-air the poured assembly prior to cure. This step is not necessary for parts involving small volumes. Large mass castings or castings with complicated shapes, conducive to air entrapment, should be de-aired prior to cure for best results.
  • Establish and use the appropriate temperatures that result in slow, even gelation. Provide a enough reservoir of cool material to replenish the shrinkage that takes place during gelation and cure.

Other Suggestions

  • Hydraulic hose fittings on vacuum lines allow for leak free connections and better vacuum.
  • 29” Hg of vacuum is sufficient for most applications.
  • 2 mm of vacuum has been found sufficient for high volume production.
  • Always use a large enough container to allow the material to rise under vacuum.
  • It may be helpful to add a drop or two of a suitable surfactant.

Precautions

Almost all formulated epoxy and urethane materials contain at least some volatile ingredients. These ingredients are an essential part of the product and will start flashing off under vacuum. This is evidenced by the fact that the mix being de-aired never seems to be totally free of bubbles no matter how long it is vacuumed. Care should be taken not to vacuum strip the material. In most cases vacuum at 29” Hg for 5- 10 minutes will sufficiently de-gas the mixture.

Download a copy of the technical tips below

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Technical Tips – Surface vs Volume Resistivity

Today we bring you a Technical Tips on how to measure resistance of materials.

There are two main methods used to calculate resistance of elastomeric materials, a pressure probe or a surface probe (in this case a CHO-PROBE). With the use of these probes different methods can be used to calculate the Volume resistivity,

Check out the full tech tips from Parker Chomerics below to get a better grasp on the topic!

#Resistivity #TechTip #protectingyourelectronics #SurfacevsVolumeResistivity 

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Capabilities – Onsite services

Applying an anti-corrosion solution can sometimes be a challenging task, whether due to insufficient training or encountering outcomes different from what you’ve seen before. While receiving advice over the phone can be beneficial, we have the resources and expertise to visit your site and provide hands-on assistance.
In partnership with our sister company @HITEK-nology Solutions we can offer anti-corrosion control services.

Services that can be provided are:


• Maintenance of equipment to prevent equipment failure
• Long term lay-up of stored equipment
• Protection of mission critical equipment
• Environmentally friendly descaling
• Corrosion removal
• Application of anti-corrosion coatings to create a barrier between the metal surface and the outside environment

Interested? Fill out a form here: https://www.hitek-ltd.co.uk/services/onsite-services

#Capability #HSL #protectingyourelectronics

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Capabilities – Sampling

We understand it can be challenging to determine if what you order is exactly what you need. That’s why we offer/provide select samples of our products. This enables you to test and discover whether our offered samples meet your requirements. Typically, we can offer next day delivery on our samples, allowing you to efficiently assess whether the product is the right fit for you.

If you’re interested in trying before buying enquire here: https://www.hitek-ltd.co.uk/services/sampling

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Capabilities – Shielded Enclosures

At HITEK our goal is to help with #protectingyourelectronics in as many ways as possible. This is why we offer the service of loaning out portable Shielded enclosures. Mobile phones are one of the most used devices in our day to day lives, making them a constant target for threats/viral interferences. This is why we have a wide selection of tents/enclosures able to be hired from us.

What can they be used for?

  • Prototype testing
  • Pre-compliance testing
  • Secure communications chamber
  • Large equipment and vehicle testing
  • Isolate sensitive and susceptible medical equipment
  • On-site testing

#Capability #Shielding #Protection

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Capabilities – Bespoke Designs

Here at HITEK we believe that having a balance between standard specifications and customer customisation is key. Factors such as size, weight, colour, material and intricacies will significantly influence the requirements necessary.

Our team use their extensive knowledge and expertise in material handling to guide you in achieving a gasket that aligns with your unique requirements.

Interested? Enquire Here : Bespoke Design – HITEK Electronic Materials LTD (hitek-ltd.co.uk)

#Design #Capability #protectingyourelectronics

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Exhibition – One month away from ETS and DVD


We are now officially one month away from our next two exhibitions of the year in ETS and DVD!

At ETS come and visit stand H55 where our experts @Dan Brown, @Roger Dent and @David McAllister will be standing by to discuss all queries/questions that you may have about #protectingyourelectronics

At DVD visit stand SP-27 where our experts @cameron Finch, @Mo Khan and @Jim Lawton will be stood by ready to talk about HSL and its anti-corrosion protection

#Exhibition #ETS #DVD

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Alfa Romeo Championship – Brands Hatch

Alfa Romeo Championships Logo

Race four is now in the books in the @Alfa Romeo Championship Associations season. The race at Brands Hatch took place just over a week ago which saw all contestants put on a great showing.

Take a look at the race report here – Brands Hatch 2024 – 2024 750MC HITEK Electronic Materials Alfa Romeo Championship (alfaracer.com)

#AlfaChampionships24 #protectingyourelectronics