Thermal Grease 65-00-T670-0080 (80cc)
Product Description
Parker Chomerics T670 Thermal Grease has a high performance thermal conducitivity of 3.0 W/m-k and is an ideal grease for thin bond line applications. T670 is a white material which offers low thermal impedance as it will typically achieve a very thin bond line (0.001 in). Typical greases within Chomerics thermal grease assortment offer a range of performance covering the simplest to the most demanding thermal requirements.
This high performance grease is supplied within an easily accessible metal can or pill. Mix this product with a spatula and remove the desired amount onto either the component or stencil screen. Now stencil the desired part size onto a heat sink for immediate assembly or shipping.
- Silicone based materials conduct heat between a hot component and a heat sink or enclosure
- Fills interface variable tolerances in electronics assemblies and heat sink applications
- Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration
- Thermally stable and require virtually no compressive force to deform under typical assembly pressures
- Supports high power applications requiring material with minimum bond line thickness and high conductivity
- Ideal for rework and field repair situations
Additional Info
Weight | 0.454 kg |
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Weight | 0.454 kg |
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£170.35 ex VAT
Only 5 left in stock
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