Permabond ES560 (5 x 200ml)

Permabond ES560 is a single-part, heat-cure epoxy adhesive specifically formulated to flow when heated. Characterised by its low viscosity and self-levelling properties, it is an ideal solution for electronics potting, encapsulation applications, and the underfilling or reworking of microchips.
With excellent adhesive strength and superior resistance to vibration and thermal cycling, Permabond ES560 ensures high-performance protection for sensitive components. This unfilled epoxy is designed for ease of use, requiring no manual mixing or weighing, and cures from a white/opaque state to a translucent finish, providing both functional reliability and a professional aesthetic.
ES560 is ideal for precision electronic assemblies as it offers a maximum gap fill of 0.1mm and exhibits free flow at high temperatures. It can reach handling strength in as little as 30 minutes at 120°C for bonding applications, or under 3 minutes when using induction curing methods.