Cho-Bond 360-20
Product Description
CHO-BOND 360-208 is a two-part epoxy adhesive with silver-plated copper particles for superior conductivity. It’s ideal for projects requiring a strong and reliable electrical bond.
- Part Name: 50-00-0360-0208
- Minimal shrinkage
- Fast heat cure, increases throughput and minimises equipment downtime
- Good for permanent bonding
- Thick paste, good for large cracks and voids (>0.25 in)
Additional Info
| Weight | 0.2 kg |
|---|
| Weight | 0.2 kg |
|---|
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£318.64 ex VAT
Available on back-order
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