Description
CHO-BOND 360-20 is a two-part epoxy adhesive with silver-plated copper particles for superior conductivity. It’s ideal for projects requiring a strong and reliable electrical bond.
£318.64 ex VAT
Available on back-order
CHO-BOND 360-20 is a two-part epoxy adhesive with silver-plated copper particles for superior conductivity. It’s ideal for projects requiring a strong and reliable electrical bond.
Weight | 0.2 kg |
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