Cho-Bond 360

£318.64 ex VAT

  • Minimal shrinkage
  • Fast heat cure, increases throughput and minimises equipment downtime
  • Good for permanent bonding
  • Thick paste, good for large cracks and voids (>0.25 in)

Available on back-order

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SKU: CH5720 Category: Tag:

Description

CHO-BOND 360-20 is a two-part epoxy adhesive with silver-plated copper particles for superior conductivity. It’s ideal for projects requiring a strong and reliable electrical bond.

Datasheets

Additional information

Weight 0.2 kg

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