Description
CHO-BOND 208 is a special two-part epoxy. When mixed in the correct ratio, these components trigger a chemical reaction that results in a robust and permanent bond. This two-part system ensures a more complete cure, maximizing the bond’s strength and electrical conductivity. It alsoboasts remarkable electrical conductivity. This means it can not only physically hold your components together but also allow electrical current to flow through the bond seamlessly.
Reviews
There are no reviews yet.