BERGQUIST SIL PAD TSP 3500
Product Description
BERGQUIST SIL PAD TSP 3500 is a thermally conductive insulating material that is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease free and reinforced with fiberglass providing high reliability for electronic packaging applications.
- Thermal impedance: 0.33℃-in²/W @ 50 psi.
- High thermal conductivity 3.5 W/m-K.
- Optimal heat transfer.
- Easy to use.
- High Thermal Conductivity: 3.5 W/m-K.
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Price range: £152.71 through £293.00 ex VAT
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