BERGQUIST GAP PAD TGP HC5000
Product Description
The BERGQUIST GAP PAD TGP HC5000 is a gap filling material designed to excel in applications where delicate handling is essential. Despite being soft and easy to work with, it boasts an impressive thermal conductivity of 5.0 W/m-K. This exceptional performance is achieved through a unique combination of fillers and a special resin that allows for efficient heat transfer even under low pressure.
- Thermal Conductivity: 5.0 W/m-K.
- High-compliance, low compression stress.
- Fiberglass reinforced for shear and tear resistance.
Additional Info
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