BERGQUIST GAP PAD TGP 800VO
Product Description
The BERGQUIST GAP PAD TGP 800VO is a cost-effective solution for managing heat in your electronic devices. This gap pad is made from a special filled polymer that efficiently conducts heat away from hot components. It comes on a convenient rubber-coated fiberglass carrier, making it easy to handle and apply during assembly.
- Thermal Conductivity: 0.8 W/m-K.
- Enhanced puncture, shear and tear resistance.
- Conformable gap filling material.
- Electrically isolating.
Additional Info
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