BERGQUIST GAP PAD TGP 2400

BERGQUIST GAP PAD TGP 2400 is an ultra-conformable, reinforced thermal interface material that delivers a thermal conductivity of 2.4 W/m-K. Formulated with a specialised filled polymer, it possesses a “gel-like” modulus and extremely elastic characteristics, ensuring superior “wet-out” even on surfaces with significant roughness. This high level of compliance allows for low “S-Class” thermal resistance at ultra-low pressures, making it perfectly suited for assemblies that utilise fixed stand-offs or clip mounting.

The integration of a fibre glass carrier enhances the material’s structural integrity, aiding in converting and handling while providing additional electrical isolation. Like other pads in the range, TGP 2400 offers natural tack on both sides for secure assembly, though a non-tack version is also available for specific requirements.
Typical applications include cooling processors and graphics chips, as well as transferring heat to frames or chassis in DVD and CDROM electronics. With a UL 94 V-0 flammability rating, it ensures both safety and high-efficiency thermal management for sensitive electronic hardware.