BERGQUIST GAP PAD TGP 2000
Product Description
BERGQUIST GAP PAD TGP 2000 excels in low-stress applications demanding moderate to high thermal conductivity. Its exceptional conformability allows it to conform to uneven surfaces, effectively filling air gaps between PCBs, heat sinks, or metal chassis with complex shapes, rough finishes, and varying heights. For user convenience, GAP PAD TGP 2000 has natural tack on both sides for easy positioning during assembly. The material is protected by liners on both sides, with the topside having reduced tack for easier handling.
- Thermal Conductivity: 2.0 W/m-K
- Low S-Class thermal resistance at very low pressures
- Highly Conformable, low hardness
- Designed for low-stress applications
- Fiberglass reinforced for puncture, shear and tear resistance
- GP2000S40-0.020-02-0816
Additional Info
| Weight | 0.324 kg |
|---|
| Weight | 0.324 kg |
|---|---|
| Part Number | GP2000S40-0.020-02-0816 |
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£113.76 ex VAT
Only 2 left in stock (can be backordered)
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