BERGQUIST GAP PAD TGP 1500
Product Description
BERGQUIST GAP PAD TGP 1500 has a low-modulus characteristic which makes the TGP 1500 soft and pliable, allowing for comfortable and convenient application during assembly. It also efficiently conducts heat away from hot components, keeping your electronics cool.
- Thermal Conductivity: 1.5 W/m-K.
- Un-reinforced construction for additional compliancy.
- Conformable, low hardness.
- Electrically isolating.
Additional Info
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