BERGQUIST GAP PAD TGP 12000ULM
Product Description
The BERGQUIST GAP PAD TGP 12000ULM takes thermal management to the next level. This gap filling material is designed specifically for high-performance applications where delicate components require minimal assembly stress. Despite its softness, it delivers outstanding heat transfer capabilities, keeping your electronics cool even under heavy workloads.
- Thermal Conductivity: 12 W/m-K
- High-compliance, low compression stress
- Ultra low modulus
Additional Info
Reviews
You must be logged in to post a review.
Price range: £233.62 through £568.64 ex VAT
Reviews
There are no reviews yet.