BERGQUIST GAP PAD TGP 12000ULM

SKU: 12000ULM

Product Description

The BERGQUIST GAP PAD TGP 12000ULM takes thermal management to the next level. This gap filling material is designed specifically for high-performance applications where delicate components require minimal assembly stress. Despite its softness, it delivers outstanding heat transfer capabilities, keeping your electronics cool even under heavy workloads.

  • Thermal Conductivity: 12 W/m-K
  • High-compliance, low compression stress
  • Ultra low modulus

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Price range: £233.62 through £568.64 ex VAT

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