Ablestik 66c Conductive Epoxy

Ablestik 66C is a high-performance, silver-filled epoxy designed for high-precision electrical bonding. Formulated for scenarios where traditional soldering is impossible as heat could damage the components or soldering is not feasible on the given material.

This “Low Flow” silver liquid provides a stable electrical path while remaining exactly where it is applied. Like other versatile Ablestik systems, 66C can be paired with different catalysts to adjust the cure profile and final thermal ceiling, making it a flexible tool for both R&D and high-volume production.