Ablestik 285 Thermal Epoxy
Product Description
Ablestik 285 is a highly versatile, thermally conductive epoxy adhesive designed for high-stakes thermal management. When paired with Catalyst 9, it becomes a general-purpose powerhouse for bonding metals and ceramic substrates, particularly in heat sink applications.
The standout feature of this system is its thixotropic, non-sag consistency. Unlike thinner epoxies that might run during the curing process, Ablestik 285 stays exactly where it is dispensed. This makes it the ideal choice for vertical surface bonding or for creating controlled bond-line thicknesses between components and heat dissipators.
- Low coeffiecent of thermal expansion (CTE).
- General use.
- Strong bond.
- Chemical resistant.
- Thermally conductive.
- Thixotropic.
- Non-sag.
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