Stycast E 2502 (30g)

Stycast E 2502 is a one-component, low-stress, epoxy encapsulant designed for high-reliability potting in sensitive electronic applications. Supplied as a black, low-viscosity liquid, this material requires no mixing or weighing, which ensures consistent processing and significantly reduces material waste on the assembly line. The formulation is engineered with a high filler content of approximately 67% by weight to provide stable handling and controlled flow, making it particularly effective for the precision encapsulation of sensors and other intricate components.

In its uncured state, the material exhibits a Brookfield viscosity that can be tuned via temperature, dropping from approximately 15-30 Pa-s at 25℃ down to 4.4 Pa-s at 50℃ to facilitate easier filling of tight gaps. It offers a generous pot life of up to 5 days at room temperature, allowing for extended production runs without the risk of premature gelation. Typical cure profiles include 3 hours at 120℃ or 1.5 to 2 hours at 150℃, and components may be preheated to 70℃ to further improve flow efficiency and ensure a void-free finish.

Once the curing process is complete, the material forms an exceptionally stable and high-purity shield with a Shore D hardness of at least 90 and a high glass transition temperature reaching up to 199℃. It provides reliable electrical insulation through a volume resistivity of 2.4×10^16 ohm-cm while maintaining dimensional stability during thermal cycling due to a low thermal expansion coefficient of 24 ppm/K. Designed to operate safely between -40℃ and +180℃, this encapsulant is ideal for demanding environments where long-term reliability and low ionic contamination are essential for performance.